Application of high-strength and high thermal conductivity aluminum alloy in artificial intelligence
Information summary：High strength and high thermal conductivity aluminum alloys have wide applications in the fields of artificial intelligence and large-scale computing power, mainly reflected in the following aspects:
High strength and high thermal conductivity aluminum alloys have wide applications in the fields of artificial intelligence and large-scale computing power, mainly reflected in the following aspects:
1. Cooling system
Data center liquid cooling plate: In large data centers, with the continuous increase of single cabinet power, such as Google Oregon data center, aluminum liquid cooling plate combined with immersion cooling technology, the power density of single cabinet is increased to 50kW. High thermal conductivity aluminum alloy liquid cooling plate, such as products optimized with 6-series aluminum alloy formula, has a thermal conductivity of over 180W/(m · K), and can achieve uniform heat dissipation through multi-channel integrated extrusion process, suitable for immersion and cold plate liquid cooling systems.
AI server heat dissipation module: The expansion of artificial intelligence computing power infrastructure places strict requirements on heat dissipation materials. Aluminum based composite materials are gradually replacing traditional copper heat sinks due to their excellent thermal conductivity (237W/m · K) and cost advantages, and are widely used in server heat dissipation modules. The amount of aluminum based heat dissipation materials used for a single AI server can reach 15-20 kilograms.
structural component
Lightweight rack: In large computing facilities such as data centers, 6061-T6 aluminum alloy extruded rack columns and beams are used, with a tensile strength of ≥ 310MPa and a weight reduction of 40% compared to steel structures. At the same time, modular assembly design is adopted to support customers' rapid deployment and expansion needs.
Robot precision components: In the artificial intelligence related robot industry, aluminum alloy accounts for over 40% of precision components such as robot joints, reducer housings, sensor brackets, etc. Compared to traditional steel, aluminum alloy has a 30% lower density and higher fatigue strength, which can effectively improve the dynamic response accuracy of robots and extend their service life.
2. Other applications
Chip packaging: Although nickel based alloys have important applications in the field of chip packaging, high thermal conductivity aluminum alloys can also be used in some chip packaging scenarios that require certain heat dissipation and strength, providing good heat dissipation and mechanical protection for chips, ensuring their stability during high load operation.
3D printing heat dissipation structure: Sichuan Zenglong's high thermal conductivity aluminum alloy spherical powder materials (TC-180 and TC-210), combined with 3D printing technology, can manufacture topology optimized heat dissipation structures that are difficult to achieve with traditional processes, such as biomimetic flow channels, microchannel arrays, etc. They have great potential for applications in 5G base stations, data centers, consumer electronics, and other fields.
Address: No. 15, Liuzhou Road, Yushan High-tech Industrial Park, Changshu
E-email：info@sinupower.com
CN
EN 
微信號：
Wechat
Visit us
Please Call